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40002 BF1105R ASI10712 N4732 4SMA13 S6025L LT6107 AN78L18M
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 Rev. 1.0
BSS 83 P
SIPMOS (R) Small-Signal-Transistor
Features
* P-Channel
*
Product Summary Drain source voltage Drain-source on-state resistance Continuous drain current
VDS RDS(on) ID
3
-60 2 -0.33
V
Enhancement mode
W
A
* Avalanche rated * Logic Level * dv/dt rated
2
1
VPS05161
Type
BSS 83 P
Package
SOT-23
Ordering Code
Q67041-S1416
Marking
YAs
Pin 1
G
PIN 2
S
PIN 3
D
Maximum Ratings,at T j = 25 C, unless otherwise specified Parameter Symbol
Continuous drain current
Value
-0.33 -0.27
Unit
A
ID
T A = 25 C T A = 70 C
Pulsed drain current
I D puls
EAS
EAR
dv/dt
-1.32
9.5
0.036
6
kV/s
T A = 25 C
Avalanche energy, single pulse
I D = -0.33 A , V DD = -25 V, RGS = 25 W
Avalanche energy, periodic limited by Tjmax Reverse diode dv/dt
mJ
I S = -0.33 A, V DS = -48 V, di/dt = 200 A/s, T jmax = 150 C
Gate source voltage
Power dissipation
VGS
Ptot
T j , T stg
20
0.36
-55...+150
55/150/56
V
W
C
T A = 25 C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Page 1
2003-06-23
Rev. 1.0
Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point ( Pin 3 ) SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 1) Symbol min. Values typ. -
BSS 83 P
Unit max. 150 K/W
RthJS RthJA
-
-
-
350 300
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Static Characteristics Drain- source breakdown voltage Symbol min. Values typ. -1.5 max. -2 A -0.1 -10 -10 2 1.4 -1 -100 -100 3 2 nA V Unit
V(BR)DSS VGS(th) IDSS
-60 -1
VGS = 0 V, I D = -250 A
Gate threshold voltage, VGS = VDS I D = -80 A Zero gate voltage drain current
VDS = -60 V, V GS = 0 V, T j = 25 C VDS = -60 V, V GS = 0 V, T j = 125 C
Gate-source leakage current
IGSS RDS(on) RDS(on)
-
VGS = -20 V, VDS = 0 V
Drain-source on-state resistance
W
VGS = -4.5 V, I D = -0.27 A
Drain-source on-state resistance
VGS = -10 V, I D = -0.33 A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2
2003-06-23
Rev. 1.0
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol min.
Dynamic Characteristics Transconductance Input capacitance
BSS 83 P
Values typ. max.
Unit
VDS2*I D*RDS(on)max , ID = -0.27 A VGS = 0 V, V DS = -25 V, f = 1 MHz
Output capacitance
gfs Ciss Coss Crss t d(on)
0.24 -
0.47 62 19 7 23
78 24 9 35
S pF
VGS = 0 V, V DS = -25 V, f = 1 MHz
Reverse transfer capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Turn-on delay time ns
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43 W
Rise time
tr
-
71
106
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43 W
Turn-off delay time
t d(off)
-
56
70
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43 W
Fall time
tf
-
61
76
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43 W
Page 3
2003-06-23
Rev. 1.0
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol min.
Dynamic Characteristics Gate to source charge
BSS 83 P
Values typ. max.
Unit
Q gs Q gd Qg V(plateau)
-
0.12 1.1 2.38 -2.94
0.18 1.65 3.57 -
nC
VDD = -48 V, ID = -0.33 A
Gate to drain charge
VDD = -48 , ID = -0.33 A
Gate charge total
VDD = -48 V, ID = -0.33 A, V GS = 0 to -10 V
Gate plateau voltage V
VDD = -48 V , I D = -0.33 A
Parameter Reverse Diode Inverse diode continuous forward current
Symbol min.
Values typ. -0.84 59.4 37.5 max. -0.33 -1.32 -1.1 89 56
Unit
IS ISM VSD trr Qrr
-
A
T A = 25 C
Inverse diode direct current,pulsed
T A = 25 C
Inverse diode forward voltage V ns nC
VGS = 0 V, I F = -0.33
Reverse recovery time
VR = -30 V, IF=I S , di F/dt = 80 A/s
Reverse recovery charge
VR = -30 V, IF=l S , diF/dt = 80 A/s
Page 4
2003-06-23
Rev. 1.0
Power Dissipation Drain current parameter: VGS 10 V
BSS 83 P
BSS 83 P
Ptot = f (TA)
BSS 83 P
ID = f (TA )
0.38
-0.36
W A
0.32 -0.28 0.28 -0.24
Ptot
ID
-0.20 -0.16 -0.12 -0.08 -0.04 0.00 0
0.24 0.20 0.16 0.12 0.08 0.04 0.00 0
20
40
60
80
100
120
C
160
20
40
60
80
100
120
C
160
TA
TA
Safe operating area
Transient thermal impedance
I D = f ( VDS )
parameter : D = 0 , T A = 25 C
-10
1
ZthJC = f (tp )
parameter : D = tp /T
10 3
BSS 83 P
BSS 83 P
A
tp = 88.0s
100 s
K/W
-10
0
/I D =
10 2
ID
RD
-10
-1
S(
) on
1 ms
Z thJC
10 1 D = 0.50
10 ms
VD
S
0.20 0.10 -10 -2 DC 10 0 0.05 single pulse 0.02 0.01
-10 -3 -1 -10
-10
0
-10
1
V
-10
2
10 -1 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10
s 10 4
VDS
Page 5
tp
2003-06-23
Rev. 1.0
Typ. output characteristic
BSS 83 P
Typ. drain-source-on-resistance
I D = f (VDS); T j=25C parameter: tp = 80 s
BSS 83 P
RDS(on) = f (ID )
parameter: VGS
BSS 83 P
-0.80
Ptot = 0W
jk i hlf e d g
VGS [V] a -2.5
b -3.0 -3.5 -4.0 -4.5 -5.0 -5.5 -6.0 -6.5 -7.0 -8.0 -10.0
W
6.5
a b c
A
5.5 5.0
c
RDS(on)
-0.60
c
d e f g
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
d e lfg i j hk
ID
-0.50
-0.40
h i
-0.30
j
bk
l
-0.20
-0.10
a
VGS [V] =
a b c d e f -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 g h i j -5.5 -6.0 -6.5 -7.0 k l -8.0 -10.0
0.5 0.00 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 V -5.0 0.0 0.00
-0.10
-0.20
-0.30
-0.40
-0.50 A
-0.65
VDS
ID
Typ. transfer characteristics I D= f ( V GS )
VDS 2 x I D x RDS(on)max
parameter: tp = 80 s
-1.2
A
Typ. forward transconductance
gfs = f(ID); Tj=25C
parameter: gfs
0.70
S
-1.0 -0.9 -0.8
0.60 0.55 0.50
ID
0.45
gfs V
-0.7 -0.6 -0.5 -0.4 -0.3
0.40 0.35 0.30 0.25 0.20 0.15
-0.2 -0.1 0.0 0.0 -1.0 -2.0 -3.0 -4.0 -6.0
0.10 0.05 0.00 0.00 -0.10 -0.20 -0.30 -0.40 -0.50
A ID
-0.70
VGS
Page 6
2003-06-23
Rev. 1.0
Drain-source on-state resistance Gate threshold voltage
BSS 83 P
RDS(on) = f (Tj)
parameter : I D = -0.33 A, VGS = -10 V
BSS 83 P
VGS(th) = f (Tj)
parameter: VGS = VDS , ID = -80 A
-3.0
W
RDS(on)
5.5
V
4.5 4.0 3.5 3.0 -1.5 2.5 2.0 1.5 1.0 0.5 0.0 -60 -20 20 60 100
C
V GS(th)
98%
-2.0
typ
98%
2%
typ
-1.0
-0.5
180
0.0 -60
-20
20
60
100
Tj
160 C Tj
Typ. capacitances
Forward characteristics of reverse diode
C = f (VDS)
parameter: VGS=0V, f=1 MHz
10
3
IF = f (VSD )
parameter: Tj , tp = 80 s
-10 1
BSS 83 P
pF
A
10 2
-10 0
Ciss
C
Coss
10 1 -10 -1
Crss
IF
Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)
10 0 0
-5
-10
-15
-20
-25
V
-35
-10 -2 0.0
-0.4
-0.8
-1.2
-1.6
-2.0
-2.4 V
-3.0
VDS
VSD
Page 7
2003-06-23
Rev. 1.0
Avalanche energy Typ. gate charge
BSS 83 P
EAS = f (Tj)
para.: I D = -0.33 A , VDD = -25 V, RGS = 25
10
VGS = f (QGate )
parameter: ID = -0.33 A pulsed
BSS 83 P
-16
mJ
V
8 -12 7
E AS
VGS
6 5 4 3
-10
-8 0,2 VDS max 0,8 VDS max
-6
-4 2 1 0 25 -2
45
65
85
105
125
C
165
0 0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8 nC
3.4
Tj
QGate
Drain-source breakdown voltage
V(BR)DSS = f (Tj)
BSS 83 P
-72
V
-68 -66 -64 -62 -60 -58 -56 -54 -60
V(BR)DSS
-20
20
60
100
C
180
Tj
Page 8
2003-06-23
Rev. 1.0
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer.
BSS 83 P
Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 9
2003-06-23


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